MIJING 3D BGA REBALL STENCIL FOR IPHONE A10
MIJING 3D BGA REBALL STENCIL FOR IPHONE A10
iPhone 7 Plus
MacFactory Bengaluru
Apple Home 24th Main Road 1st Sector HSR Layout
981, Shop no 5, First Floor, SR Complex, 7th Cross, 24th Main Rd, next to NOUS infosystems, 1st Sector, HSR Layout, WhatsApp No. +918928847647
560102 Bengaluru KA
India
MacFactory Mumbai
MacFactory Lamington Road Shapur Baug Grant Road
71, 1st Floor, Rajesh Building, Opposite of D.B Marg Police Station, Lamington Road, (Sunil) WhatsApp : +91 9870433422
400007 Mumbai MH
India
0.025mm thickness
It is 3D.
- A8 contains all 6 / 6Plus / BGA
- A9 contains all 6s / 6s Plus
- A10 contains all 7 / 7 Plus
- A11 contains all 8 / 8 Plus / X
Features:
- Stepped groove design enables stencil to align with the tinning position of ic rapidly.
- The square holes design makes it easier to take out the formed solder balls.
- This 3D stencil is easy to use no matter you are new or an expert.
- The high success rate of planting tin, the solder balls can be formed once after you are proficient.
- This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.